World Library  


Add to Book Shelf
Flag as Inappropriate
Email this Book

Metallurgy Materials Science and Engineering Laboratory

Click here to view

Book Id: WPLBN0000697143
Format Type: PDF eBook
File Size: 389.08 KB.
Reproduction Date: 2005
Full Text

Title: Metallurgy Materials Science and Engineering Laboratory  
Author:
Volume:
Language: English
Subject: Technology., Reference materials, Technology and literature
Collections: Techonology eBook Collection
Historic
Publication Date:
Publisher:

Citation

APA MLA Chicago

Metallurgy Materials Science and Engineering Laboratory. (n.d.). Metallurgy Materials Science and Engineering Laboratory. Retrieved from http://netlibrary.net/


Description
Technical Reference Publication

Excerpt
Introduction: This report describes the major technical activities and accomplishments of the Metallurgy Division of the NIST Materials Science and Engineering Laboratory (MSEL) in 1998. The NIST Metallurgy Division mission is to provide critical leadership in developing measurement methods, standards, and fundamental understanding of materials behavior needed by US industry for the more effective production and use of both traditional and emerging materials. As part of this mission we are responsible not only for developing new measurement methodologies with broad applicability across materials classes and industries, but also for working with individual industry groups to develop and integrate measurements, standards, and evaluated data for specific, technologically important applications.

Table of Contents
TABLE OF CONTENTS Page INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SIGNIFICANT ACCOMPLISHMENTS AND IMPACTS . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 TECHNICAL ACTIVITIES ELECTRONIC PACKAGING, INTERCONNECTION, AND ASSEMBLY . . . . . . . . . . . . . 7 Solderability Measurements for Microelectronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Solder Interconnect Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Precision Optoelectronics Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Stress Measurements in Electronic Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Metallurgy of the Electrical Contacts to Gallim Nitride Semiconductors . . . . . . . . . . . . 19 On-Chip Interconnect Metrology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 MAGNETIC MATERIALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Giant Magnetoresistance Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Processing and Micromagnetics of Thin Magnetic Films . . . . . . . . . . . . . . . . . . . . . . . . 31 Magnetic Properties of Nanomaterials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Magnetics for Steel Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Magnetic Properties of Superconductors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 METALS DATA AND CHARACTERIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 High-Resolution Thermophysical Measurements During Pulse-Heating . . . . . . . . . . . . 47 Mechanical and Thermal Properties of Multilayered Materials . . . . . . . . . . . . . . . . . . . 51 Rockwell Hardness Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Magnetic Properties and Standard Reference Materials . . . . . . . . . . . . . . . . . . . . . . . . . 58 Performance of Structural Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Performance of Materials in Corrosive Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Magneto-Optical Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Development of Scanning Acoustic Microscopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Electron Microscopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 METALS PROCESSING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Processing of Advanced Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Solidification Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Sensors and Diagnostics for Thermal Spray Processes . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Electrodeposition of Aluminum Alloys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Electrodeposited Coating Thickness Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

 

Click To View

Additional Books


  • Evaluated Kinetic and Photochemical Data... (by )
  • Toward Next-Generation Construction Mach... (by )
  • Reporting 
  • Secure Cyberspace 
  • Thermodynamic Properties of Dioxygen Dif... (by )
  • Thermodynamic Functions and Properties o... (by )
  • Cross Sections and Related Data for Elec... (by )
  • Cross Sections and Swarm Coefficients fo... (by )
  • Administrative Modifications 
  • Indefinite Delivery Indefinite Quantity ... 
  • Credit Card Purchases 
  • Awards 
Scroll Left
Scroll Right

 



Copyright © World Library Foundation. All rights reserved. eBooks from World Library are sponsored by the World Library Foundation,
a 501c(4) Member's Support Non-Profit Organization, and is NOT affiliated with any governmental agency or department.